| abstract |
An assembly 100 and method of making same are provided. The assembly 100 can include a first component 105 including a dielectric region 120 having an exposed surface 122, a conductive pad 134 at the surface 122 defined by a conductive element 132 having at least a portion extending in an oscillating or spiral path along the surface 122, and a an electrically conductive bonding material 140 joined to the conductive pad 134 and bridging an exposed portion 137 of the dielectric surface 122 between adjacent segments 136, 138. The conductive pad 134 can permit electrical interconnection of the first component 105 with a second component 107 having a terminal 108 joined to the pad 134 through the electrically conductive bonding material 140. The path of the conductive element 132 may or may not overlap or cross itself. |