| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bfc9b7e1b79e8ad1724f6870edb449b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7155611df1d3e6d4fc35e9be0e6815b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1f1b5b0407702a20d4c48fb4e70ba6e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a278588145e0820a55d768cee80ce75c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf99ca4588ecc0292dc2298fba759626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c54a49ae9156905719d161d88aaf174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_515b10ebcfe82a718b21c408ace219a8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
2011-11-24^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_645b9ce54e2c3daf53248e6aad92266e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9b5fd0c8098b68fd677b8ec614c56d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_302250629e14102be483646b01e811e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7deeec0dd20eea4c0ec24280302c99ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_236e72334a3e88d76baa2434f44ae44a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74ea00032d7e905434caeba585792c3b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d982e2caab534ee0c7f2728b8bec815 |
| publicationDate |
2012-05-31^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2012070612-A1 |
| titleOfInvention |
Method for producing electronic device, electronic device, method for producing electronic device package, electronic device package, and method for producing semiconductor device |
| abstract |
The present invention relates to: a method for producing an electronic device; an electronic device; a method for producing an electronic device package; an electronic device package; and a method for producing a semiconductor. One embodiment of the present invention provides: a method that is for producing an electronic device and that, in a production process for a redisposed electronic device, can easily eliminate residue if residue is adhered without causing damage to a sealing material or an electronic component and without causing mispositioning of the electronic component; a highly reliable electronic device; a method for producing an electronic device package; and an electronic device package. One embodiment of the method for producing an electronic device is characterized by having: a step for forming an affixing resin layer; a step for affixing an electronic component; a step for forming a sealing material layer; a step for obtaining a sealing material curing product that has the electronic component disposed; and a step for delaminating the sealing material curing product that has the electronic component disposed from a supporting substrate. The method for producing an electronic device is further characterized by delaminating the sealing material curing product that has the electronic component disposed from the sealing substrate by means of heating and melting the affixing resin layer after radiating active energy rays at the affixing resin layer in the step for delaminating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113497174-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113497174-B |
| priorityDate |
2010-11-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |