| abstract |
Provided are: a prepreg which has a low water-absorbing rate, rarely undergoes the deterioration in insulation resistance over time, and also has excellent heat resistance; a metal-foil-cladded laminate board produced using the prepreg; a printed wiring board produced using the metal-foil-cladded laminate board; and others. This prepreg is produced by impregnating a base (D) with a resin composition or applying the resin composition onto the base (D), wherein the resin composition comprises (A) a naphthol-modified dimethylnaphthalene formaldehyde resin, (B) an epoxy resin having an epoxy equivalent of 200-400 g/eq. and (C) an inorganic filler. |