| abstract |
This method for manufacturing a semiconductor device is provided with the steps of preparing lead frames that include a plurality of die pads (11), and a plurality of semiconductor chips (41), positioning each semiconductor chip (41) on any one of the plurality of die pads (11), forming an encapsulating resin (7) that covers the plurality of die pads (11) and the plurality of semiconductor chips (41), and, after forming the encapsulating resin (7), joining a heat sink (6) to the plurality of die pads (11) by sandwiching a resin sheet (862), which is an adhesion layer, and pressing the heat sink (6) against the plurality of die pads (11). |