| abstract |
Disclosed are a quad flat no lead package component and a manufacturing method therefor. The package component comprises a lead frame carrier (1) formed by three circles of pins arranged around a carrier dent (14) and the carrier dent (14). The three circles of pins are respectively formed by a plurality of pins which are not connected to each other. An integrated-circuit chip (3) is stuck in the carrier dent (14), and all the pins are respectively plated with an inner pin ENEPIG layer (11); the inner pin ENEPIG layer (11) and the integrated-circuit chip (3) are arranged in the same direction, and the integrated-circuit chip (3) is connected to the inner pin ENEPIG layer (11) through a bonding wire (8). The integrated-circuit chip (3), one end of all the inner pin ENEPIG layers (11), and the bonding wires (8) are encapsulated in a plastic package body (15). |