| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_57972991270d7d535753fecf047a9eb4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-14663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2045-1477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18162 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-566
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14754
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3185 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14 |
| filingDate |
2014-09-26^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0b5a4b7f75149a3d2051ef990f68be1 |
| publicationDate |
2015-04-02^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2015047089-A1 |
| titleOfInvention |
Method for moulding and surface processing electronic components and electronic component produced with this method |
| abstract |
The invention relates to a method for moulding and surface processing electronic components wherein a grid of electronic components is attached on a carrier; subsequently foil is placed against the side of the electronic components opposite to the carrier and are the electronic components partially encapsulated. After moulding the foil is removed from the electronic components and a free side of the components is surface processed. The invention also relates to a partial encapsulated electronic component as produced with such a method. |
| priorityDate |
2013-09-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |