| abstract |
The present application relates to an adhesive composition, a protective film for a conductive laminate, and a conductive laminate. A cured product of the adhesive composition, according to the present application, can protect the surface of a conductive laminate and the like by forming an adhesive layer to be adhered to a hard coating surface of the conductive laminate and the like, and can be used as a protective film by maintaining a suitable peeling force irrespective of peeling velocity even after heat treatment for sintering. |