http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016203834-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F20-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2016-04-19^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57d69c998ba644a25a483999a8d015ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c607cdb583055fac7d5dbe1b287fa1a8 |
| publicationDate | 2016-12-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2016203834-A1 |
| titleOfInvention | Pattern-forming method and electronic device production method |
| abstract | Provided are: a pattern-forming method whereby a pattern having excellent CDU can be formed; and an electronic device production method. The pattern-forming method comprises: a film-formation step in which a film is formed upon an undercoat layer of a support body having the undercoat layer and a substrate, said film being formed by using an actinic ray-sensitive or a radiation-sensitive resin composition; an exposure step in which the film is exposed; a developing step in which the film is developed after the exposure step, a resist pattern is formed, and at least part of the undercoat layer is exposed; and an etching step in which the exposed undercoat layer is etched using a plasma generated from a processing gas including deposition gas and a deposit is caused to accumulate on the side surface of the resist pattern. The composition contains a resin having a weight-average molecular weight of at least 5,000 and having an acid-decomposable group. In the developing step, either an alkaline developing step or an organic agent developing step is implemented, followed by the other of these two steps. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112920314-A |
| priorityDate | 2015-06-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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