http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017137682-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76814 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2017-02-03^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a61e53769f8d13ed96746431120e6547 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1357a5e862dd9d3893aaa29a94094399 |
| publicationDate | 2017-08-17^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-2017137682-A1 |
| titleOfInvention | Process for producing connections to an electronic chip |
| abstract | The invention relates to a process for producing conductive connections (30) to an electronic chip, comprising the following steps: a) depositing an insulating layer (7, 9) on one face of a wafer; b) producing a layer based on at least one metal covering the insulating layer and equipped with first apertures; c) etching second apertures in the insulating layer (7, 9) in the extension of the first apertures by plasma etching in a plasma based on at least one halogen-containing compound; d) vacuum annealing the entire structure obtained after step c); and e) forming, after step d), the conductive connections in the second apertures. |
| priorityDate | 2016-02-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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