http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018008527-A1

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filingDate 2017-06-29^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0675f1b048d167c7ad33e74412695bfc
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publicationDate 2018-01-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2018008527-A1
titleOfInvention Silicon carbide semiconductor device, and production method therefor
abstract All of the intervals between adjacent p-type guard rings (21) are made to be equal to or smaller than the interval between p-type deep layers (5). As a result, the intervals between the p-type guard rings (21) become larger, i.e. trenches (21a) become less dense, and thus a p-type layer (50) can be inhibited from being formed thick in a guard ring section when grown epitaxially. Accordingly, if the p-type layer (50) in a cell section is to be removed during etching back, the p-type layer (50) can be removed without leaving residue in the guard ring section. Therefore, when the p-type layer (50) is etched back and the p-type deep layers (5), the p-type guard rings (21), and p-type connecting layers (30) are formed, residue of the p-type layer (50) can be inhibited from being left in the guard ring section.
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priorityDate 2016-07-05^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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