| abstract |
The purpose of the present invention is to provide: a cleaning composition which can remove a layer of interest satisfactorily using a conventional apparatus, such as a coater, a baking furnace (a curing furnace) and a cleaning chamber, installed in semiconductor manufacturing equipment while preventing the damage or deformation of layers other than the layer of interest, such as a substrate and an interlayer insulation film; a cleaning method using the cleaning composition; and a method for producing a semiconductor employing the cleaning method.nA layer of interest formed on a substrate is cleaned with a cleaning composition containing a component (A) capable of decomposing the layer of interest and a film-forming polymer (B). An example of the layer of interest is a hard mask film. An example of the component (A) is at least one compound selected from a basic compound (A1) and an acidic compound (A2). |