| abstract |
This laser machining system is provided with: a wavelength-variable laser device that outputs laser beams for both an absorption line representing wavelengths of light absorbed by oxygen and a non-absorption line representing wavelengths of light less absorbed by oxygen than that of the absorption line; an optical system that irradiates an object to be machined with a laser beam; and a laser control unit that is for controlling the wavelength-variable laser device by setting, when machining the surface of the object to be machined with laser in a gas that contains oxygen, the wavelength of the laser beam outputted from the wavelength-variable laser device to the non-absorption line, and setting, when cleaning the surface of the object to be machined with ozone in a gas that contains oxygen, the wavelength of the laser beam outputted from the wavelength-variable laser device to the absorption line. |