| abstract |
[Problem] To prevent characteristic degradation due to a positional displacement between a waveguide and a backshort. [Solution] A high-frequency module 13 is provided with: a package part 6 comprising a semiconductor chip 1, a first portion 3A of a backshort 3, the first portion being integrated with the semiconductor chip by means of a first resin 2, and a first rewiring line 5 electrically connected to the semiconductor chip and including a portion serving as an antenna coupler 4; and a waveguide 7 with which a second portion 3B of the backshort 3 is integrated. The package part and the waveguide are integrated by means of a second resin 8 such that the portion serving as the antenna coupler is located between the waveguide and the backshort. |