| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2023-4031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2023-4087
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-117
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10159
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2023-405 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-7076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-7005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-721
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
2018-01-16^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6220019b5fa4467dc0b8918b144b5dc1 |
| publicationDate |
2018-07-26^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018136428-A1 |
| titleOfInvention |
Conductive stress-relief washers in microelectronic assemblies |
| abstract |
Microelectronic device assembly including a component attached to substrate by at least a screw. The screw applies compressive force against a pad of a thermally and electrically conductive material having sufficiently low modulus to mitigate stress in addition to providing a thermal and electrical path between the component and the substrate. In some embodiments, the screw affixes a printed circuit board hosting one or more integrated circuit components to a motherboard, or passive heat sink. The pad may be deformed to assuage stress applied through the screw during assembly of the device and/or as the device experiences thermal cycling, for example associated with intermittent operation. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I755269-B |
| priorityDate |
2017-01-19^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |