| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a62555ff12316a9a118542896b4c0af7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6e9f273df8f87036e60dcaae4ea9d8ca |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-54 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-702
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0876 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-046 |
| filingDate |
2017-08-02^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b79b80737ef040b8b1fc355c021c078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5517a12015dd5391081612fe039a557b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edbdab589a8c57473985c91cf1ad2471 |
| publicationDate |
2018-08-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018145428-A1 |
| titleOfInvention |
Laser processing device and laser processing method |
| abstract |
Provided are a laser processing device and a laser processing method. The laser processing device comprises a cutting stage (10) configured to carry a to-be-processed workpiece (15); a distance measuring unit (12) configured to measure the distance of the workpiece (15) on a predetermined processing path (11) to obtain a three-dimensional processing data (16) of the workpiece (15); and a laser processing unit (13) configured to process the workpiece (15) with the laser (130) on the basis of the three-dimensional processing data (16). The laser processing device can adjust the focus position of the laser (130) on the workpiece (15) in real time according to the three-dimensional processing data (16) during the laser processing, thus ensuring that the laser (130) is accurately focused on the to-be-processed surface of the workpiece (15), improving the processing quality of the laser processing, enhancing the adaptability to the degree of deformation of the workpiece (15), reducing rejection rate, and improving product yield. |
| priorityDate |
2017-02-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |