| abstract |
This resin composition contains a solvent and a polyimide precursor having the structure represented by formula (1) {in the formula, R1 represents a divalent organic group and, when there is a plurality thereof, the R1's independently represent divalent organic groups; R2 represents a tetravalent organic group and, when there is a plurality thereof, the R2's independently represent tetravalent organic groups; n is a positive integer.}, wherein the weight average molecular weight of the polyimide precursor is 110,000 to 250,000 and the solids content of the resin composition is 10-25 mass%. |