| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
| filingDate |
2018-11-19^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9858f9a285a68fc1f921660d883b159e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6b29e89c2322d4d55ae30941311e37b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d0ebc12e61d6392ebe8a374646e0f95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_246f9ca18dae74f5d5d98f55040ea529 |
| publicationDate |
2019-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019145064-A1 |
| titleOfInvention |
Electroless gold plating bath |
| abstract |
The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to form ula ( 1 ) wherein each X is independently an alkanediyl group; R1, R2, R3 and each R4 are independently alkanediyl groups;M is independently hydrogen, a metal atom or a cation form ing radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 1 0.The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, I C substrates, semiconducting devices, interposers made of glass and t he like. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022180867-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6953068-B1 |
| priorityDate |
2018-01-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |