| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22 |
| filingDate |
2018-07-18^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11466234c318f88eb44d2052fde06bd4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddfa387213da42c29b49c95f8ea9bd9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4190d971206252c7bf5a204ae1af3de3 |
| publicationDate |
2019-10-03^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019187186-A1 |
| titleOfInvention |
Tape for semiconductor processing |
| abstract |
The present invention provides a tape for semiconductor processing which can be sufficiently heated and contracted for a short period of time and can maintain a kerf width. This tape 10 for semiconductor processing of the present invention has an adhesive tape 15 having: a base film 11; and an adhesive layer 12 formed on at least one surface side of the base film 11, and the adhesive tape 15 is characterized in that the total sum of an average value of differential values of thermal deformation rates per 1°C in an MD direction which are measured by a thermomechanical property tester when the temperature rises between 40°C and 80°C, and an average value of differential values of thermal deformation rates per 1°C in a TD direction which are measured by the thermomechanical property tester when the temperature rises between 40°C and 80°C is a minus value. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021079955-A1 |
| priorityDate |
2018-03-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |