| abstract |
In an embodiment, a resin formulation is provided. The resin formulation includes a curable resin; a hardener, wherein a concentration of hardener is from 15 wt% to 80 wt% based on a total weight of the curable resin; and a surfactant, wherein a concentration of surfactant is from 0.1 wt% to 5 wt% based on the total weight of the curable resin. In another embodiment, a method of treating a wellbore is provided. The method includes adding to a subterranean wellbore a volume of a resin formulation, the resin formulation comprising a curable resin, a hardener, and a surfactant; and allowing the resin formulation to form a sealant. |