| abstract |
The base (10) of an integrated circuit package (100) comprises a first side (11), and a second side (12) opposing the first side (11). The base (10) further comprises, a base mounting section (20), a die mounting section (30), and a recessed section (40). The recessed section (40) comprises a recess (41) between the die mounting section (30) and the base mounting section (20). The base (10) further comprises an opening (21) extending through the base (10) from the first side (11) to the second side (12). At least a portion of the recess (41) intersects with the opening (21). |