| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_447017a95b31009750124aae2395b205 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-573 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
| filingDate |
2020-04-10^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6273982ab2a6f282dd816d33e30b5149
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19056804a38ec10e7a7c0e366c71a04b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1302ec8f35c82b11f8aa21b5af7c09a7 |
| publicationDate |
2020-10-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020210703-A1 |
| titleOfInvention |
Protective elements for bonded structures |
| abstract |
A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over at least a portion of the active circuitry. The obstructive material can be configured to obstruct external access to the active circuitry. The bonded structure can include a disruption structure configured to disrupt functionality of the at least a portion of the active circuitry upon debonding of the protective element from the semiconductor element. |
| priorityDate |
2019-04-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |