| abstract |
The present invention provides a resin-type conductive paste composition which uses a silver-based powder as a conductive powder, and which enables a cured product thereof to have a favorably decreased volume resistivity. A conductive paste composition according to the present invention is configured such that: a conductive powder (A) is a silver-based powder that uses at least silver; a resin component (B) is at least one of a thermosetting resin and a thermoplastic resin; and additionally, an ester compound (C) that comprises an ester structure represented by general formula (1) or (2), while having a molecular weight within the range of from 150 to 2,000, or a salt of the ester compound (C), or a specific ether/amine compound (D) having a molecular weight within the range of from 150 to 30,000 is contained therein. (In the formulae, one of X1 and X2 represents Cl or Br, and the other represents Cl, Br, H or OH.) |