| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_646018b7183a929bbb6e26dcdb62a8da |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28D15-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K20-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-06 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22F1-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K20-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28D15-02 |
| filingDate |
2020-06-10^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c771b0e0cda53902fc349a8370057935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69e8c1e8f0e39bcef3158ea8bb590afc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22c87ea2cb3636d18207da84cd0ec1b6 |
| publicationDate |
2020-12-24^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2020255836-A1 |
| titleOfInvention |
Copper composite plate material, vapor chamber in which copper composite plate material is used, and method for manufacturing vapor chamber |
| abstract |
There is provided a copper composite plate material in which: one surface of a first copper layer is pressure-welded to a second copper layer; the first copper layer is configured from a precipitation-strengthened copper alloy; and the second copper layer is configured from pure copper in which the Cu content is 99.9 mass% or higher, or is configured from a non-precipitation-strengthened copper alloy in which the Si content is less than 0.1 mass%. |
| priorityDate |
2019-06-20^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |