| abstract |
The purpose of the present invention is to provide a photosensitive resin composition from which a cured film can be obtained which has high reliability and excellent bendability, has excellent processability of uneven patterns, and has sufficient light diffusivity. In order to achieve said purpose, a photosensitive resin composition according to the present invention includes (A) a siloxane resin, (B) particles having a median diameter of 0.2-0.6 μm, and (C) a naphthoquinone diazide compound, wherein (A) the siloxane resin contains at least 20-60 mol% of a repeating unit represented by general formula (1). (R1 represents a C6-C18 aryl group or a C6-C18 aryl group in which the entirety or a portion of hydrogen is substituted.) |