Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-402 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32862 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4404 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-0272 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-5096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4581 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4586 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-458 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-033 |
filingDate |
2020-10-27^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b4316dfb9370a36954aa54738dbf83a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d5b8c3edd969524faa0508fdb3757d8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dad72c1c68d59ab23d11fcf38db69aa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6398cdc75b9b015be65e3b16bac8e64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4117126262ce5b9c245f0f4b85c7f905 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d47edbe719c2ecc69bcdc8f8ab4c06f6 |
publicationDate |
2021-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2021086835-A1 |
titleOfInvention |
Reduced defect deposition processes |
abstract |
Exemplary methods of semiconductor processing may include forming a silicon oxide material on exposed surfaces of a processing region of a semiconductor processing chamber. The methods may include forming a silicon nitride material overlying the silicon oxide material. The methods may include performing a deposition process on a semiconductor substrate disposed within the processing region of the semiconductor processing chamber. The methods may include performing a chamber cleaning process. |
priorityDate |
2019-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |