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publicationDate 2021-05-06^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2021086835-A1
titleOfInvention Reduced defect deposition processes
abstract Exemplary methods of semiconductor processing may include forming a silicon oxide material on exposed surfaces of a processing region of a semiconductor processing chamber. The methods may include forming a silicon nitride material overlying the silicon oxide material. The methods may include performing a deposition process on a semiconductor substrate disposed within the processing region of the semiconductor processing chamber. The methods may include performing a chamber cleaning process.
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