| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98a75c9fff239084cf3c988c59841957 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3105 |
| filingDate |
2020-12-02^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01215a5d7ba6b169c5377f85db5e59f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc4408ae8b158abb89842fd302e5e12f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbc4e85e963216bd77e51338e2842080
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5355b61940d8d3d8c1adf36b1bb7af62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_228ca79c2824ab1eb4f8ee31f81f7409 |
| publicationDate |
2021-06-10^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021113285-A1 |
| titleOfInvention |
High oxide film removal rate shallow trench isolation (sti) chemical mechanical planarization (cmp) polishing |
| abstract |
High oxide film removal rate Shallow Trench Isolation (STI) chemical mechanical planarization (CMP) polishing compositions, methods, and systems of use therefore are provided. The CMP polishing composition comprises abrasives of ceria coated inorganic oxide particles, such as ceria-coated silica; and a chemical additive for providing a high oxide film removal rate. The chemical additive is a gelatin molecule possessing negative and positive charges on the same molecule. |
| priorityDate |
2019-12-04^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |