| abstract |
Heat sealable compositions suitable for film and film structures comprise: (a) from 30 to 70 weight percent of a low melting polymer comprising an ethylene based copolymer having a density of from 0.88 g/cm3 to 0.915 g/cm3, a melt index of from 1.5 dg/min to 7.5 dg/min, a molecular weight distribution no greater than 3.5, and a composition distribution breath index greater than 70 percent; and, (b), being different from (a), from 70 to 30 weight percent of a propylene based polymer having from 88 mole percent to 100 mole percent propylene and from 12 mole percent to 0 mole percent of an alpha-olefin other than propylene. |