"Package - System Thermal Modeling and New Material."

Tsung-Yu Chen et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631543

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-17

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Tsung-Yu Chen, Kris Chuang, Wensen Hung, Tsung-Shu Lin, Yen-Ming Chen:
Package - System Thermal Modeling and New Material. VLSI Technology and Circuits 2024: 1-2

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