"The impact of copper contamination on the quality of the second wire ..."

T. Y. Lin et al. (2002)

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DOI: 10.1016/S0026-2714(02)00003-3

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type: Journal Article

metadata version: 2020-02-22

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T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai:
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectron. Reliab. 42(3): 375-380 (2002)

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