| abstract |
The invention relates to an electronic component with a semiconductor chip (2) and copper conductor tracks (3) on the semiconductor chip (2), the copper conductor tracks (3) connecting semiconductor electrode surfaces (4) to copper contact surfaces (6) and connecting lines from the copper contact surfaces (6) Contact pads (8) of a carrier system and wherein the copper contact surfaces (6) have residues (10) of an organic protective layer. The invention further relates to a method for producing such an electronic component. |