| abstract |
A method of manufacturing a semiconductor wafer, comprising: Covering Lotkugelelementen (20) for electrically contacting electrically operable structures of the semiconductor wafer with an organic layer (3), wherein the Lotkugelelemente (20) are designed for a flip-chip contacting and the organic layer (3) consists of a substance, which completely evaporates from the surface of the Lotkugelelemente (20) in a contacting process. |