| abstract |
Chip module comprising: - a carrier substrate (1) having a chip surface (2) and a contact pad surface (3) facing the chip surface (2), - a chip (11) fixed on the chip surface (2) of the carrier substrate (1) is at least one chip connection contact (9), - at least one contact field (4) which is formed on the contact pad surface (3), - at least one passage (6) in the carrier substrate (1) between the contact pad surface (3) and the Chip surface (2) is formed, - at least one of a wire (5) formed electrical connection between the at least one chip connection contact (9) and the at least one contact field (4), wherein the wire (5) with the contact field (4) by means of Drahtbondverbindung (8a), - a stabilizing material (7), which is introduced into the passage (6) and of which the wire (5) in addition to the wire bonding connection (8a) on the contact field (4) against a Abr is fixed by the contact pad (4), and - a ... |