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filingDate 2004-07-05^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-01-26^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102004032605-A1
titleOfInvention Semiconductor component with a semiconductor chip and electrical connection elements to a conductor structure
abstract ThenThe invention relates to a semiconductor device (1) with a semiconductor chipn(3) and electrical connection elements (4) to a conductor structuren(5) and a method for producing the same. This is indicated by the ladder structuren(5) a chip island (6) and contact pads (7). These are coplanarnarranged to each other. The semiconductor structure (5) is of anfillednPlastic film (8) selectively coated. Both the semiconductor chip (3)nas well as the electrical connection elements (4) are by means ofnfoil-covered chip island (6) or the foil-covered contact pads (7)nmechanically fixed and electrically connected.
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