| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9884b2360f2413d7edea0d5af39f775a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-186 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52 |
| filingDate |
2017-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3cf9d3ece4c47000d20d5f458a9e0824
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecea2240ffcb37aec484f724b7696173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3685cd908e73d3bb87f6677613d91f5f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c301b18fababc0ab1ce43902d3f1871b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ffa68da2b85ff0359b59966d5de5773
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bc869105571939d214a2a891b84e6f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0d868164d71951d246c5a63f9227647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_983918c4a7bf69bee4c4408ca1c04518 |
| publicationDate |
2019-02-07^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
DE-102017117425-A1 |
| titleOfInvention |
Method for producing an optoelectronic component |
| abstract |
In a method for producing an optoelectronic component, a carrier is provided with an upper side. An optoelectronic semiconductor chip is arranged above the upper side of the carrier. Furthermore, a potting material is arranged above the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the potting material. The potting material forms a potting surface. Particles are sprayed onto the potting surface with some of the particles remaining on the potting surface creating a topography on the potting surface. |
| priorityDate |
2017-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |