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publicationDate 2017-07-20^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2017207372-A1
titleOfInvention Method of forming light emitting diode with high-silica substrate
abstract A method of making an LED device and an LED device using a high-silica, fully-sintered glass substrate is provided. The high-silica substrate is at least 99% silica and is thin, such as less than 200 μm in thickness. A phosphor containing layer is deposited on to the substrate and is laser sintered on the substrate such that a portion of the sintered phosphor layer embeds in the material of the substrate.
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priorityDate 2016-01-15^^<http://www.w3.org/2001/XMLSchema#date>
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