| abstract |
A copper alloy composition comprising 100 parts by weight of a powdery copper alloy of the general formula AgxCuy (wherein 0.001 </= x </= 0.999, 0.001 </= y </= 0.999 and x + y = 1), 5 to 200 parts by weight of an organic binder, and 0.01 to 100 parts by weight of an additive which serves to remove copper oxides; and a paste for screen printing, an electromagnetic wave shield, a conductive adhesive, a paste for electrodes, and a paste for through holes each prepared from the composition. |