http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069
Outgoing Links
| Predicate | Object |
|---|---|
| concordantIPC | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| level | 11^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H05K3/4069 |
| modified | 2013-01-01^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4053 |
Incoming Links
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