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filingDate 1994-02-18^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d54a93da94c70610aaaf20560509bb71
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publicationDate 1994-10-26^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0621633-A2
titleOfInvention Leadframe for integrated circuits
abstract Lead frames completely plated with palladium, which have a nickel-phosphorus or a copper-tin alloy layer between the base body, which is made of copper, for example, are readily bondable and can be easily soldered both before and after aging without prior tinning.
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