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filingDate 1994-11-21^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1995-11-15^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0681743-A1
titleOfInvention Plasma deposition process with substrate temperature control
abstract In a glow discharge deposition process for the preparation of hydrogenated, Group IV semiconductor alloys, the substrate is maintained at a temperature which is positively correlated with the deposition rate and which is high enough to impart sufficient kinetic energy to the layer to activate the removal of undesirable morphologies, but low enough to prevent degradation of the layer caused by the excessive loss of hydrogen.
priorityDate 1993-11-26^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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