| abstract |
A component built-in module includes an electric insulation layer 101,nfirst wiring patterns 102a and 102b in a plurality of layers that are laminatednwith the electric insulation layer 101 being interposed therebetween, at leastnone first inner via 104 electrically connecting the first wiring patterns inndifferent layers with each other, and at least one electronic component 103 thatnis embedded in the electric insulation layer 101 and is mounted on any one ofnthe first wiring patterns in the plurality of layers, wherein at least one of thenfirst inner vias 104 is present in a range that overlaps a range in which thenelectronic component 103 is present in a lamination direction in which the firstnwiring patterns 102a and 102b are laminated, and has a height in thenlamination direction that is smaller than a height of the electronic componentn103. Since the first inner via 104 has a small height, the via diameter can bendecreased. Therefore, it is possible to provide a component built-in modulenthat has high reliability and is suitable for high-density component mounting. |