| abstract |
Compounds that function to provide level or uniform metal deposits are provided. Thesencompounds are particularly useful in providing level copper deposits. Copper plating baths andnmethods of copper plating using these compounds are also provided. These baths and methodsnare useful for providing a planarized layer of copper on a substrate having small apertures. Thencompositions and methods provide complete fill of small apertures with reduced void formation. |