| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2012-05-07^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9772932d08918cb4bf2dda530b273cca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b06b480d0a36d91eed71db5ea3dd6ed |
| publicationDate |
2013-11-13^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-2662885-A1 |
| titleOfInvention |
A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (cmp) of iii-v material in the presence of a cmp composition comprising a compound containing an n-heterocycle |
| abstract |
A process for the manufacture of semiconductor devices comprising the chemical-mechanical polishing of a substrate or layer containing at least one III-V material in the presence of a chemical-mechanical polishing composition (Q1) comprising n(A) inorganic particles, organic particles, or a mixture or composite thereof, n(B) a polymer comprising at least one N-heterocycle, and n(M) an aqueous medium. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3792321-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111216034-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108717945-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108717945-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11254840-B2 |
| priorityDate |
2012-05-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |