| abstract |
(57) Abstract: Provided is a lead frame in which an outermost plating layer formed on a surface layer of a metal substrate in a pre-plating frame is improved, and a method for manufacturing the lead frame. SOLUTION: A protective layer is formed using Ni or a Ni alloy on an upper surface of a metal substrate, an intermediate layer made of Pd or a Pd alloy is formed on an upper surface of the protective layer, and Pd and Au are formed on an upper surface of the intermediate layer. A lead frame is formed by alternately plating to form a mixed layer in which Pd particles and gold particles coexist as an outermost layer. As a result, a lead frame having improved wire bonding properties, solderability, and adhesion to resin can be obtained, and the manufacturing cost can be reduced. |