http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101677061-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate | 2012-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-11-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-11-29^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101677061-B1 |
| titleOfInvention | Leadframe and semiconductor package thereof |
| abstract | The present invention relates to a lead frame and a semiconductor package using the lead frame. More particularly, the present invention relates to a lead frame, and more particularly, to a lead frame having a structure in which a Pd-Au alloy plating layer and a Pd plating layer are laminated on the entire surface A lead frame including a thin film plating layer formed on the lead frame, and a semiconductor package including the lead frame. Through this, a palladium-gold alloy plating layer is formed on the copper material surface of the joining portion of the lead frame in order to maintain the palladium thin film plating on the joining portion of the wire in the lead frame using the precious metal wire such as Au, Ag, A palladium plating layer is formed on the upper surface to reduce the plating thickness of the palladium to reduce the manufacturing cost and to prevent the rapid diffusion and oxidation of the copper as a raw material of the lead frame due to heating during wire bonding, do. |
| priorityDate | 2012-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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