| abstract |
(57) [Problem] To provide a copper foil for a printed wiring board excellent in peeling strength without increasing the surface roughness in order to cope with miniaturization of circuit wiring and enhancement of the function of a base material. And a method of manufacturing the same. A rust prevention treatment layer, a coupling agent treatment layer, A copper foil for a printed wiring board having an adhesion-imparting layer comprising an epoxy resin polymer having a weight-average molecular weight of 70,000 or more, wherein the thickness of the adhesion-imparting layer is expressed in terms of a thickness in terms of weight. It is a copper foil for printed wiring boards characterized by being 0.5 to 5 g / m 2 . By using an epoxysilane-based coupling agent as the coupling agent, a copper foil for a printed wiring board having excellent peel strength can be obtained. In the step of producing an adhesiveness-imparting layer on a copper foil to produce a copper foil for a printed wiring board, a solution containing 1 to 10% of an epoxy resin polymer is applied to the copper foil. This is a method for producing a copper foil for use. |