http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101327565-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12438 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D11-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D9-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-24 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D11-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D9-08 |
| filingDate | 2010-05-28^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-11-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101327565-B1 |
| titleOfInvention | Copper foil for semiconductor package substrate and substrate for semiconductor package |
| abstract | Copper foil for semiconductor package board | substrates which consists of a chromate treatment layer formed in the roughening surface of copper foil used as an adhesive surface with resin, or the coating layer which consists of zinc, zinc oxide, and chromium oxide, and a silane coupling agent layer. Cr amount of the said chromate-treated layer is 25-150 microgram / dm < 2> , and Zn is 150 microgram / dm < 2> or less, Copper foil for semiconductor package substrates characterized by the above-mentioned. At least 1 type or more of the silane coupling agent layer contains the alkoxysilane provided with the tetraalkoxy silane and the functional group which has reactivity with resin in the silane coupling agent layer, The copper foil for said semiconductor package board | substrates. When copper foil is laminated | stacked on a resin base material and soft-etches a circuit using a sulfuric acid type etching liquid, it is a subject to establish the electrolytic treatment technology of copper foil which can prevent a circuit erosion phenomenon effectively. |
| priorityDate | 2009-06-05^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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