| abstract |
The present invention provides a chemical mechanical polishing method for providing a polishing surface having a high polishing rate in a convex portion of a material to be polished, a low polishing speed in a concave portion, and a polishing surface having high flatness. The chemical mechanical polishing method comprises 0.02 to 5% by mass of abrasive grains and at least one water-soluble polymer selected from a polymer having a carboxyl group, a polymer having a sulfonic acid group, and a nitrogen-containing polymer. A chemical mechanical polishing step using a chemical mechanical polishing aqueous dispersion containing 0.02 to 5% by mass of a polymer, water, carbon dioxide, hydrogen peroxide, ammonia, amine, amide, organic acid and alcohol A non-chemical mechanical polishing step using at least one non-chemical mechanical polishing aqueous medium selected from aqueous solutions containing at least one selected from the group consisting of: [Selection diagram] Fig. 1 |