| abstract |
[Summary] PROBLEM TO BE SOLVED: To improve the alignment accuracy for application of a resin composition and improve the resolution of patterning processing in a photolithography technique when applied on a substrate. A resin composition for forming an adhesive layer used for bonding a semiconductor component and a substrate, comprising a resin having a radical polymerizable double bond, a thermosetting resin, an alkali-soluble group, and a two-component resin. And a resin having a double bond. [Selection figure] None |