http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7999354-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24273 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02372 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-40 |
| filingDate | 2008-06-11^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-08-16^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d17af992ec3d68de42fbd0276b44b42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd717ce101354a0150e137584b24d77c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94e0829386d5bd69704ea568ec7de45f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d8751050e75c8654a1f4e24c2aef225 |
| publicationDate | 2011-08-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-7999354-B2 |
| titleOfInvention | Resin composition, filling material, insulating layer and semiconductor device |
| abstract | A resin composition of the present invention is used for forming a filling material which fills at least a through-hole of a semiconductor substrate, the through-hole extending through the semiconductor substrate in a thickness direction thereof and having a conductive portion therein. The resin composition is composed of: a resin having a radical-polymerizable double bond, a thermosetting resin and a resin which differs from the resin having the radical-polymerizable double bond and has an alkali-soluble group and a double bond; or a cyclic olefin resin. A filling material of the present invention is formed of a cured product of the above resin composition. An insulating layer of the present invention is formed of a cured product of the above resin composition. The insulating layer includes: a layer-shaped insulating portion provided on a surface opposite to a functional surface of the semiconductor substrate; and a filling portion integrally formed with the insulating portion and filling the through-hole. A semiconductor device of the present invention includes the above insulating layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014200285-A1 |
| priorityDate | 2007-06-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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