| abstract |
The present invention provides a prepreg, a laminate or a printed wiring board to which an epoxy resin composition having both dispersibility of varnish and high thermal conductivity is applied. [Solution] In the prepreg in which a sheet-like fiber base material is impregnated with an epoxy resin composition containing an epoxy resin and a curing agent to be in a semi-cured state, the epoxy resin is an epoxy resin compound having a molecular structure represented by (formula 1), An inorganic filler having a thermal conductivity of 20 W / m · K or more is contained in the epoxy resin so as to be 10 to 900 parts by volume with respect to 100 parts by volume of the resin solid content. A laminated board and a printed wiring board are comprised using the said prepreg. [Chemical 1] [Selection figure] None |